System Scaling Meeting & Discussion Video

More than Moore – Enabling the Power of System Scaling:
An Open Discussion About Design and Manufacturing Challenges

On the evening of May 17 th at 6PM   the ESD Alliance hosted an open dialogue about system scaling solutions and what it will take to propel them into the mainstream for semiconductor design and manufacturing. Although various system scaling technologies (such as interposer-based designs, using die-level IP blocks, like HBM) are already in use today, they have not yet crossed into the mainstream.

MultiChip Module

System scaling offers an excellent alternative path to pursuing Moore’s Law by moving the integration focus from the transistor to the integration of several heterogeneous pre-fabricated and proven devices, in the form of die-level IP, into an advanced IC package. Although new sub- 10nm process technologies continue to drive Moore’s Law, development cost and times at these advanced nodes are beyond the reach of much of the mainstream market. 

It will take collaboration and cooperation between modeling, design, analysis/verification, manufacturing and test in order to unlock the potential of these new integration solutions. The objective for the meeting is to have an open discussion to identify the highest priority issues that should be jointly worked on to streamline the path to widespread adoption. The ESD Alliance is in the process of forming a working group representing both manufacturing and design to work on practical solutions and is seeking community input on direction and priorities.

 


 

Participants:
  Bob Smith, Executive Director, ESD Alliance
Herb Reiter
, President, eda2asic Consulting, Inc.
Event Host:
  ESD Alliance Logo